ODVA 2025 Industry Conference

This paper presents an overview of the use of Artificial Intelligence (AI)/Machine Learning (ML) applications in the Autonomous Train Technology Market including passenger and freight trains. This paper will also discuss extending the Autonomous Train Technology into the Autonomous Trolley and Bus Markets.

This paper describes how, on train wagons, the AI/ML applications can be connected to a single Gigabit Ethernet network that uses CIP. This network connects all sensors, controllers, and actuators in the wagons, as well as wired and wireless entertainment, and feeds the information to the AI/ML applications.

Though the Artificial Intelligence/Machine Learning (AI/ML) subjects (Reasoning with Uncertainty, Autonomous Path Planning, Collision Avoidance, Swarm Technology, Sensor Fusion, etc.) are used to support the use cases of Train, Trolleys.

This paper will describe the following:

• The top impacting factors of the autonomous train technology market including its Compound Annual Growth Rate (CAGR), and the regions it is being widely adopted.
• Describe the Concept of the following Grade of Automation (GoA) pertaining the trains, trolleys, and busses:
• Describe Autonomous Train, Trolly Use Cases with benefits:
  • Assisted Operation
  • Driverless Depot Operation
  • Driverless Vehicle Stabling and Provision
  • Driverless operation on Specific Sections
  • Fully Automated Operation on Entire Lines
• Additional autonomous benefits

Author
George Ditzel, Schneider Electric

One of the conclusions emerging from the project to improve ODVA’s device description files is the recognition of the importance of metadata.  The addition of metadata to the CIP object model and its inclusion in offline device descriptors would make it possible for tools to provide contextualized presentation of devices both off-line and on-line.  Similarly, an intermediate conclusion of the Common Industrial Cloud Infrastructure (CICI) SIG has been that embedded metadata in devices enables information discovery and understanding in data science use cases.

In this paper, we will revisit the use cases for metadata in devices and will present concepts for implementing metadata support and illustrations of how this can result in enhanced representation of devices.

Authors
Greg Majcher, Rockwell Automation
Michael Schaffner, Rockwell Automation

Wireless communication technology is becoming increasingly used in our daily lives and as such has found its way into industrial automation through a variety of mediums. Of these wireless technologies, Bluetooth is a respected technology for wireless communication in the consumer market due to its reliability, universal adoption, ease of use, and low cost. Bluetooth is a key communication technology driver behind the Internet of Things and with the increased adoption and implementation of the Industrial Internet of Things, Bluetooth technology expands the communication selection in the industrial automation ecosystem.  

This paper aims to explore the potential for implementing Bluetooth for industrial use cases with CIP communications as the application layer interface for devices and software clients. It will examine the recent enhancements to the Bluetooth specifications that allow its potential use in the market, along with Bluetooth's security, stability, technical specifications, and the mapping of CIP onto Bluetooth transport with the exploration of implementing extensions of CIP onto Bluetooth. Additionally, feasibility by exploring use cases, industrial considerations, security at the application layer, and ODVA impact will be considered during this session’s content.

Authors
Mark Trautman, HMS Industrial Networks
Zach Farmer, HMS Industrial Networks
Todd Wiese, Rockwell Automation

In the Spring 2023 publication of the CIP family of specifications, ODVA announced the addition of an important new technology, Concurrent Connections which enables flexible, zero switchover time, end-to-end redundancy solutions. Since that time Concurrent Connections sparked interest and evolved. The Concurrent Connections topic was presented at the ODVA 2023 Industry Conference and triggered discussions. The topic resonated at CIP System Architecture Special Interest Group meetings, which resulted in two CIP Specification Enhancements clarifying Concurrent Connections behavior. The Concurrent Connections are the backbone of new CIP Safety solutions.

The Concurrent Connections are inherently coupled with device redundancy. The mechanism of redundancy, both in controllers and devices, is rightly left vendor-specific because it does not impact multi-vendor interoperability. However, vendors would like to see ODVA-defined best practices to implement redundancy in both controllers and devices to simplify their adoption of concurrent connections and ensure that end-user system expectations are met. This paper discusses potential best practices to support controller and device vendors, with a specific focus on these areas that they struggle with today:

• How to coordinate originators of a concurrent connection?
• How to meet the requirements for the concurrent connection payload production on the endpoints of the concurrent connection?
• How to handle concurrent connection payload consumed by redundant devices? 

Finally, this paper offers a brief plan for the adoption and implementation of Concurrent Connections technology.

Authors
Filip Zembok, Rockwell Automation
Darren Klug, Rockwell Automation 
Jakub Korbel, Rockwell Automation

EtherNet/IP In-cabinet system is intended to replace the hardwiring between devices with a single composite media that provides both power and communication. This innovative approach simplifies installation, reduces engineering time and leverages the intelligence in the devices to provide greater information for maintenance and process optimization. In this paper, we highlight the transformative impact of the SPE/T1S implementation, as defined by ODVA's released specification. We will explore the expansion of the EtherNet/IP In-cabinet ecosystem and discuss strategies to overcome barriers to technology adoption.  This includes sharing knowledge on the EMC performance of flat ribbon cables, expanding application use cases through integration with CIP Safety, ensuring futureproofing with compatibility to upcoming IEEE standards, and advancements in flat media and connector development in IEC standards.

Authors
Yutao Wang, Rockwell Automation
David Brandt, Rockwell Automation
Kelly Passineau, Rockwell Automation
Vivek Hajarnavis, Rockwell AutomationAbstract: